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 DISCRETE SEMICONDUCTORS
DATA SHEET
k, halfpage
M3D168
BZG03 series Voltage regulator diodes
Product specification Supersedes data of 1996 Jun 07 2002 Jul 04
Philips Semiconductors
Product specification
Voltage regulator diodes
FEATURES * Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * UL 94V-O classified plastic package * Zener working voltage range: 10 to 270 V for 35 types * Supplied in 12 mm embossed tape. DESCRIPTION DO-214AC surface mountable package with glass passivated chip.
BZG03 series
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
handbook, 4 columns
Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.
,, ,, ,,
k
cathode band a
Top view
Side view
MSA473
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Ptot Ptot PZSM Tstg Tj PARAMETER total power dissipation total power dissipation non-repetitive peak reverse power dissipation storage temperature junction temperature CONDITIONS Ttp = 100 C; see Fig.2 Tamb = 50 C; see Fig.2; device mounted on an Al2O3 PCB (see Fig.5) tp = 100 s; square pulse; Tj = 25 C prior to surge; see Fig.3 MIN. - - - -65 -65 MAX. 3.00 1.25 600 +175 +175 UNIT W W W C C
2002 Jul 04
2
Philips Semiconductors
Product specification
Voltage regulator diodes
ELECTRICAL CHARACTERISTICS Total series Tj = 25 C unless otherwise specified. SYMBOL VF PARAMETER forward voltage CONDITIONS IF = 0.5 A; see Fig.4
BZG03 series
MAX. 1.2 V
UNIT
Per type Tj = 25 C unless otherwise specified. TYPE No. SUFFIX
(1)
WORKING VOLTAGE VZ (V) at IZ MIN. NOM. 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 110 120 130 150 MAX. 10.6 11.6 12.7 14.1 15.6 17.1 19.1 21.2 23.3 25.6 28.9 32 35 38 41 46 50 54 60 66 72 79 87 96 106 116 127 141 156
DIFFERENTIAL RESISTANCE rdif () at IZ TYP. 2 4 4 5 5 6 6 6 6 7 7 8 8 21 21 24 24 25 25 25 25 30 30 60 60 80 80 110 130 MAX. 4 7 7 10 10 15 15 15 15 15 15 15 15 40 40 45 45 60 60 80 80 100 100 200 200 250 250 300 300
TEMPERATURE TEST COEFFICIENT CURRENT SZ (%/K) at IZ MIN. 0.05 0.05 0.05 0.05 0.05 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.07 0.07 0.07 0.07 0.08 0.08 0.08 0.08 0.09 0.09 0.09 0.09 0.09 0.09 MAX. 0.09 0.10 0.10 0.10 0.10 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.11 0.12 0.12 0.12 0.12 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 0.13 IZ (mA) 50 50 50 50 50 25 25 25 25 25 25 25 25 10 10 10 10 10 10 10 10 10 10 5 5 5 5 5 5
REVERSE CURRENT at REVERSE VOLTAGE IR (A) MAX. 7 4 3 2 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 VR (V) 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 110
C10 C11 C12 C13 C15 C16 C18 C20 C22 C24 C27 C30 C33 C36 C39 C43 C47 C51 C56 C62 C68 C75 C82 C91 C100 C110 C120 C130 C150
9.4 10.4 11.4 12.4 13.8 15.3 16.8 18.8 20.8 22.8 25.1 28 31 34 37 40 44 48 52 58 64 70 77 85 94 104 114 124 138
2002 Jul 04
3
Philips Semiconductors
Product specification
Voltage regulator diodes
BZG03 series
TYPE No. SUFFIX
(1)
WORKING VOLTAGE VZ (V) at IZ MIN. NOM. 160 180 200 220 240 270 MAX. 171 191 212 233 256 289
DIFFERENTIAL RESISTANCE rdif () at IZ TYP. 150 180 200 350 400 450 MAX. 350 400 500 750 850 1000
TEMPERATURE TEST COEFFICIENT CURRENT SZ (%/K) at IZ MIN. 0.09 0.09 0.09 0.09 0.09 0.09 MAX. 0.13 0.13 0.13 0.13 0.13 0.13 IZ (mA) 5 5 5 2 2 2
REVERSE CURRENT at REVERSE VOLTAGE IR (A) MAX. 1 1 1 1 1 1 VR (V) 120 130 150 160 180 200
C160 C180 C200 C220 C240 C270 Note
153 168 188 208 228 251
1. To complete the type number the suffix is added to the basic type number, e.g. BZG03-C130. THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 note 2 Notes 1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer 35 m, see Fig.5. 2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer 40 m, see Fig.5. For more information please refer to the "General Part of associated Handbook". CONDITIONS VALUE 25 100 150 UNIT K/W K/W K/W
2002 Jul 04
4
Philips Semiconductors
Product specification
Voltage regulator diodes
GRAPHICAL DATA
BZG03 series
handbook, halfpage
4
MBH451
104 handbook, halfpage PZSM (W) 103
MBH452
Ptot (W) 3
2
102 1
0 0 100 T (C) 200
10 10-2
10-1
1
tp (ms)
10
Solid line: tie-point temperature. Dotted line: ambient temperature; device mounted on an Al2O3 PCB as shown in Fig.5.
Tj = 25 C prior to surge.
Fig.3 Fig.2 Maximum total power dissipation as a function of temperature.
Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse).
handbook, halfpage
3
MBH453
50
IF (A) 2 4.5 50 1 2.5
0 0 1 VF (V) 2
1.25
MSB213
Tj = 25 C. Dimensions in mm.
Fig.4
Forward current as a function of forward voltage; typical values.
Fig.5 Printed-circuit board for surface mounting.
2002 Jul 04
5
Philips Semiconductors
Product specification
Voltage regulator diodes
PACKAGE OUTLINE Transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors
BZG03 series
SOD106
H D
A A1 c Q
E
b
(1)
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 2.3 2.0 A1 0.05 b 1.6 1.4 c 0.2 D 4.5 4.3 E 2.8 2.4 H 5.5 5.1 Q 3.3 2.7
Note 1. The marking band indicates the cathode. OUTLINE VERSION SOD106 REFERENCES IEC JEDEC DO-214AC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-06-09
2002 Jul 04
6
Philips Semiconductors
Product specification
Voltage regulator diodes
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS
BZG03 series
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2002 Jul 04
7
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613514/03/pp8
Date of release: 2002
Jul 04
Document order number:
9397 750 09764


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